Join us for new information on powering mobile and wearable products and receive an added bonus of a quick update on the status of the FHE MII at this one-day, high-powered workshop. Understanding the ever-changing landscape and promising developments in power generation, usage and storage is key to all players in the mobile technology field. The workshop kicks off with these two perspectives:
Join us for new information on powering mobile and wearable products and receive an added bonus of a quick update on the status of the FHE MII at this one-day, high-powered workshop. Understanding the ever-changing landscape and promising developments in power generation, usage and storage is key to all players in the mobile technology field. The workshop kicks off with these two perspectives:
Marc Chason & Associates will present an analysis of primary batteries, as well as rechargeable batteries, for mobile and wearable products. Specific aspects of product functionality (e.g., rechargeable, flexible, rollable, foldable, etc.) will be described. New approaches to battery manufacturing will be assessed using a Technology Readiness Level (TRL) metric.
Lux Research will describe various emerging energy storage and harvesting technologies, such as thin-film batteries and thermoelectrics. The presentation will discuss today’s highly-diverse landscape and unmet power needs in wearable electronics to map out strategies for power source developers.
New – The Department of Defense recently awarded FlexTech Alliance a $75M grant to form and manage a Flexible Hybrid Electronics Manufacturing Innovation Institute (FHE MII). Join the workshop for a mission overview of this new Institute and a timeline of its initial technical roadmapping and R&D activity.
Confirmed Speakers
Air Force Research Lab, Arizona State University, BessTech, Binghamton University, Booz Allen Hamilton, CFDRC, Imprint Energy, Lux Research, Marc Chason & Associates, Molex, and NovaCentrix
Who Should Attend
• Product and Component Designers
• Electronics Integrators
• Business Development Professionals in Consumer and Military Electronics
• EMS Companies
• Mobile Device Manufacturers
• Sensor Component Suppliers
• Conductive Materials and Functional Inks Companies
• Manufacturing Equipment Providers
• SuperCapacitor Researchers and Users
• Healthcare Device Designers and Integrators
• Electronic Printing Integrators
Company Tour (optional)
The program begins on Tuesday afternoon September 29th with a tour of the Center for Advanced Microelectronics Manufacturing (CAMM), a partnership between Binghamton University (BU), i3 Electronics, Cornell University and the Flex Tech Alliance. The CAMM is the nation’s first prototype research and development (R&D) facility in large area flexible electronics. The CAMM is part of BU’s New York State Center of Excellence in Small Scale Systems Integration and Packaging (S3IP), which serves as an international resource for systems integration and packaging R&D.
Networking Dinner (optional)
A no-host networking dinner following the tour will provide introductions to industry colleagues and ample time to exchange information.